2003
View Online Export Citation RESEARCH ARTICLE | MARCH 17 2003 Multilayer diffusion barrier for copper metallization using a thin interlayer metal Cr, and Zr) between two TiN films Soo-Hyun Kim; Ki Tae Nam; Arindom Datta; Hyun-Mi Kim; Ki-Bum Kim; Dae-Hwan Kang
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